一、Overview實物圖
二、Features特色
極速AI一鍵編程，快速測試
RapidAIoneclickprogrammingandquicktesting
全球首款智能人機(jī)交互（語音識別）AOI
Theworld'sfirstintelligentHuman-ComputerInteraction(voicerecognition)
行業(yè)誤報最少檢測設(shè)備之一
Oneoftheindustry'slowestfalsealarmdetectiondevices
三、Precision optical imaging精密的光學(xué)影像
工業(yè)相機(jī)高速取像，抓拍高清
Industrialcameraforhigh-speed imagingandcapturing high-definitionphotos.
三色塔型光源RGB三色LED與多角度塔狀組合設(shè)計，能準(zhǔn)確反映出物體表面坡度層次信息
Tri-colortower-shapedlightsource:RGBtri-color LEDscombinedwithamulti-angletowerdesign,accuratelyreflectingthesurfacegradient informationofobjects.
雙遠(yuǎn)心鏡頭：拍攝圖象無視差，有效避免反光干擾，最大程度降低高元件，解決景深問題
TelecentricLens:Capturesimageswithoutparallax,effectivelyavoidsglareinterference,minimizes theimpactofhighcomponents,andresolvesdepthoffieldissues.
四、實例
五、Datasheet規(guī)格表
型號Model T5 pro | |
軌道與PCB尺寸Conveyor&PCB Size | |
PCB尺寸Dimension | 0x50mm-470x330mm |
PCB厚度Thickness | 0.5mm -5mm |
PCB元件高度Height | Top 25mm:Bottom 110mm |
PCB翹曲高度Warp | ±3mm |
工藝邊PCB Transfer Height | 2.5mm |
光學(xué)參數(shù)Optical Parameter | |
攝像頭Camera Spec | 12MP |
分辨率Resolution | 10μm |
光學(xué)鏡頭Optical Lens | 雙遠(yuǎn)心光學(xué)鏡頭Telecentric Optical Lens |
光源Light-Source | 多光譜超高速RGB六通道光源Multis pectral Super speed RGB Light Source |
速度Speed | 0.238 sec/FOV |
硬件配置Hardware | |
X/Y平臺重復(fù)定位精度Table Positioning Accuracy | +/-0.01mm |
X/Y平臺移動速度Table Speed | 900mm/s |
PCB夾持PCB Clambing | 自動夾持By Auto |
驅(qū)動Driver | 松下交流伺服電機(jī)+研磨絲桿AC Servo Motor+Screwing Shaft |
設(shè)備外觀尺寸Dimension(W*D*H) | 860X 1040X 1318mm |
重量Weight(KG) | 345KG |
電源及功率Power Supply | AC 220V 50/60Hz 1KW |
操作系統(tǒng)Operating System | Win 10企業(yè)版Enterprise Edition |
顯示器Display | 23.8”LCD Monitor |
獨立顯卡Discrete graphics | 英偉達(dá)NVIDIA 3060 |
可檢測類型Inspection Category | |
元件檢查Component Inspection | 缺件，反轉(zhuǎn)，偏移，極性，錯件，破損，AI元件彎腳，PCB板異物，金手指 沾錫，溢膠，整板偵測多件。 Missing,Rolling,Shifting,Polarity Error,Wrong Part,Damaged, Bended,PCB Abnormal,Residua,Glue Overflow |
焊接檢查Solder Inspection | 錫多錫少，側(cè)立，立碑，錫橋，虛焊，翹腳，錫珠，波峰焊后焊接(含插件) Excess Solder,Insufficient Solder,Bridging,Lifting,Solder Balls,Soldering Abnormal |
特殊檢測項目Special Inspection Items | 可檢查錫膏制程，紅膠制程及波峰焊后的PCB上元件的裝配焊接質(zhì)量，3D可 測元件高度，引腳翹起虛焊，做高度檢測 Can Check Solder Paste and Epoxy Glue Process,Soldering Quality; Checking Floating Components and Cold Joint by 3D |
軟件系統(tǒng)Software | |
檢測算法Inspection Method | AI算法、特征矢量分析法、絲印OCV算法 AI Algorithm&The Eigenvector Analysis &OCV Silkscreen Algorithm |
多角度檢測Inspection Angle Area | 0-360°,檢測精度Accuracy=1° |
標(biāo)記功能Marking Function | PCB整板Mark,拼板Mark,壞板Mark等 One Board Marking &Multi-pieces Board Marking &Bad Marking,etc. |
編程模式Programming Mode | 1.CAD坐標(biāo)自動導(dǎo)入CAD Coordinate Loading 2. 自動索引元件庫Component Database Auto-index 3.軟件自動AI建模Auto-programming by Intelligent Software |
遠(yuǎn)程控制Remote Control | 通過網(wǎng)絡(luò)實現(xiàn)：離線編程；遠(yuǎn)程實時調(diào)試；遠(yuǎn)程查看/遠(yuǎn)程控制操作設(shè)備等 Network Monitoring:Offline Debugging,Online Monitoring & Manipulating,Remote Realized Examing |
人機(jī)交互系統(tǒng)Human-Computer Interaction system | 通過語音指令控制軟件操作機(jī)器，解放雙手提升效率 Improve efficiency and free up hands by controlling software operations on machines through voice commands |
記錄功能Data Recording | 自動生成統(tǒng)計分析(SPC)及數(shù)據(jù)報表 Auto-generated Statistical Process Controlling Data(SPC)&Report |
選項Option | |
